Invention Grant
- Patent Title: Throughput optimization for bonded variable bandwidth connections
- Patent Title (中): 绑定变量带宽连接的吞吐量优化
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Application No.: US14585202Application Date: 2014-12-30
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Publication No.: US09584414B2Publication Date: 2017-02-28
- Inventor: Patrick Ho Wai Sung , Kam Chiu Ng , Ho Ming Chan
- Applicant: Patrick Ho Wai Sung , Kam Chiu Ng , Ho Ming Chan
- Applicant Address: HK Hong Kong
- Assignee: PISMO LABS TECHNOLOGY LIMITED
- Current Assignee: PISMO LABS TECHNOLOGY LIMITED
- Current Assignee Address: HK Hong Kong
- Main IPC: H04L12/741
- IPC: H04L12/741 ; H04L29/06 ; H04L12/873 ; H04L1/18 ; H04L1/16 ; H04L12/46

Abstract:
The present disclosure provides for devices, systems, and methods which optimize throughput of bonded connections over multiple variable bandwidth logical paths by adjusting a tunnel bandwidth weighting schema during a data transfer session in response to a change in bandwidth capabilities of one or more tunnels. By making such adjustments, embodiments of the present invention are able to optimize the bandwidth potential of multiple connections being used in a session, while minimizing the adverse consequences of reduced bandwidth issues which may occur during the data transfer session.
Public/Granted literature
- US20160191379A1 THROUGHPUT OPTIMIZATION FOR BONDED VARIABLE BANDWIDTH CONNECTIONS Public/Granted day:2016-06-30
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