Invention Grant
- Patent Title: Customization earphone structure and detachable audio broadcasting module thereof
- Patent Title (中): 定制耳机结构及其可拆卸音频广播模块
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Application No.: US14796473Application Date: 2015-07-10
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Publication No.: US09584900B2Publication Date: 2017-02-28
- Inventor: Shih-Hsiung Hsiao
- Applicant: COOLER MASTER TECHNOLOGY INC.
- Applicant Address: TW New Taipei
- Assignee: COOLER MASTER TECHNOLOGY INC.
- Current Assignee: COOLER MASTER TECHNOLOGY INC.
- Current Assignee Address: TW New Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: CN201510223441 20150505
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R1/28 ; H04R1/26 ; H04R1/02 ; H04H40/45

Abstract:
A customization earphone structure and a detachable audio broadcasting module thereof are disclosed in the instant disclosure. The detachable audio broadcasting module includes an amplifier assembly and a detachable sound guiding assembly. The amplifier assembly includes a first outer casing and a plurality of first retaining structures disposed on the first outer casing. The first outer casing has an assembly concave groove. The detachable sound guiding assembly includes a second outer casing corresponding to the assembly concave groove, a sound-guiding component fixed and enclosed inside the second outer casing, and a plurality of second retaining structures disposed on the second outer casing. The detachable sound guiding assembly is received inside the assembly concave groove, the second outer casing is detachably positioned inside the assembly concave groove by respectively matching the second retaining structures and the first retaining structures with each other.
Public/Granted literature
- US20160330542A1 CUSTOMIZATION EARPHONE STRUCTURE AND DETACHABLE AUDIO BROADCASTING MODULE THEREOF Public/Granted day:2016-11-10
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