Invention Grant
- Patent Title: MEMS device and process
- Patent Title (中): MEMS器件和工艺
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Application No.: US14430466Application Date: 2013-09-19
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Publication No.: US09584903B2Publication Date: 2017-02-28
- Inventor: Tsjerk Hoekstra , Mark Hesketh
- Applicant: WOLFSON MICROELECTRONICS PLC
- Applicant Address: US TX Austin
- Assignee: Cirrus Logic, Inc.
- Current Assignee: Cirrus Logic, Inc.
- Current Assignee Address: US TX Austin
- Agency: Jackson Walker L.L.P.
- Priority: GB1217002.3 20120924
- International Application: PCT/GB2013/052460 WO 20130919
- International Announcement: WO2014/045042 WO 20140327
- Main IPC: H04R1/28
- IPC: H04R1/28 ; H04R7/20 ; H04R19/00 ; H04R1/22 ; H04R19/04 ; H04R31/00

Abstract:
This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g. to provide an acoustic volume. A stop structure (401, 402) is positioned so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane. The stop structure defines one or more openings to the one or more substrate cavities and comprises at least one narrow support element (401, 402) within or between said one or more openings. The stop structure thus limits the amount of membrane deflection, thus reducing the stress experienced at the edges and prevents the membrane from contacting a sharp edge of a substrate cavity. As the stop structure comprises narrow support elements any performance impact on the transducer is limited.
Public/Granted literature
- US20150256924A1 MEMS DEVICE AND PROCESS Public/Granted day:2015-09-10
Information query
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