Provided is a printed circuit board which is used in a bent state, including: a substrate; a first conductive layer which is formed on the substrate; a first insulation layer which is formed on the substrate so as to cover the first conductive layer; and a second conductive layer which is formed on the first insulation layer, wherein on the assumption that the Youngs modulus of the first insulation layer is indicated by Ei1 and the fracture elongation of the second conductive layer is indicated by Bc2, the following equations (I) and (II) are satisfied. 10 MPa