Invention Grant
US09585239B2 Methods of manufacturing lighting assembly with thermal overmolding
有权
制造具有热过模制的照明装置的方法
- Patent Title: Methods of manufacturing lighting assembly with thermal overmolding
- Patent Title (中): 制造具有热过模制的照明装置的方法
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Application No.: US14268476Application Date: 2014-05-02
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Publication No.: US09585239B2Publication Date: 2017-02-28
- Inventor: Jeffrey Nall , Matthew Mrakovich
- Applicant: Jeffrey Nall , Matthew Mrakovich
- Applicant Address: US OH Cleveland
- Assignee: GE LIGHTING SOLUTIONS, LLC
- Current Assignee: GE LIGHTING SOLUTIONS, LLC
- Current Assignee Address: US OH Cleveland
- Agency: Fay Sharpe LLP
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/02 ; F21V29/00 ; G09F9/33 ; H05K3/28 ; F21V9/16 ; F21V23/00 ; F21V29/70 ; F21V29/85 ; F21V23/02 ; F21V31/04 ; F21V3/04 ; F21Y101/00 ; F21Y101/02
Abstract:
One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
Public/Granted literature
- US20140237814A1 LED LIGHTING ASSEMBLIES WITH THERMAL OVERMOLDING Public/Granted day:2014-08-28
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