Invention Grant
- Patent Title: Circuit boards and methods of identification and manufacturing thereof
- Patent Title (中): 电路板及其识别和制造方法
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Application No.: US14757470Application Date: 2015-12-23
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Publication No.: US09585243B1Publication Date: 2017-02-28
- Inventor: Stephen K. Pardoe , Nigel Rowe
- Applicant: OCZ Storage Solutions, Inc.
- Applicant Address: JP Tokyo
- Assignee: Toshiba Corporation
- Current Assignee: Toshiba Corporation
- Current Assignee Address: JP Tokyo
- Agency: White & Case LLP
- Main IPC: B32B3/02
- IPC: B32B3/02 ; H05K1/02 ; H05K3/00

Abstract:
Methods of manufacturing circuit boards and circuit boards formed thereby to have a surface that is configured to receive circuitry and a notch of a selectable configuration in a lateral edge along the surface of the circuit board boards, and where the selectable configuration is configured to convey identifying information relating to the circuit boards. Such a circuit board can be produced from a panel containing one or more circuit boards, wherein at least one circuit board has a border adjoined and defined by a partition feature that is configured to enable the circuit board to be physically separated from other portions of the panel. Notches having the same of varying selectable configurations may be formed on the at least one circuit board during the manufacturing of the circuit board.
Information query