Invention Grant
- Patent Title: Electronic component, electronic apparatus, and method for manufacturing the electronic component
- Patent Title (中): 电子元件,电子设备及其制造方法
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Application No.: US14520284Application Date: 2014-10-21
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Publication No.: US09585287B2Publication Date: 2017-02-28
- Inventor: Yu Katase , Fujio Ito , Tadashi Kosaka , Koji Tsuduki , Ichiro Kataoka
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A. Inc., IP Division
- Priority: JP2013-222521 20131025
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/36 ; H01L23/055 ; H01L23/498

Abstract:
An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.
Public/Granted literature
- US20150116946A1 ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT Public/Granted day:2015-04-30
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