Invention Grant
- Patent Title: Baffle plate assembly
- Patent Title (中): 挡板组件
-
Application No.: US14299722Application Date: 2014-06-09
-
Publication No.: US09585288B2Publication Date: 2017-02-28
- Inventor: Clifton Cary Powers , Yiu Lam Chan , Chia-Hsing Liao , Ying-Chou Su
- Applicant: ADC Telecommunications, Inc.
- Applicant Address: US NC Hickory
- Assignee: CommScope Technologies LLC
- Current Assignee: CommScope Technologies LLC
- Current Assignee Address: US NC Hickory
- Agency: Merchant & Gould P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/18 ; H04Q1/02

Abstract:
A baffle plate assembly for installation in a rack structure is disclosed. In one aspect, the baffle plate assembly is configured to direct cooling air from a front side of the rack structure to cooling air inlet(s) of equipment located directly above the baffle plate assembly, and to block heated air from below or behind the baffle plate assembly from entering the equipment cooling air inlet(s). In one aspect, the baffle plate assembly includes a baffle plate defining a first surface plane, a pair of side plates, and a pair of mounting brackets. The side plates are configured to extend along the baffle plate while the mounting brackets may be attached to the side plates. In one aspect, the baffle plate first surface plane forms an oblique angle with respect to a plane defined by a first plate member of the mounting brackets.
Public/Granted literature
- US20150076097A1 BAFFLE PLATE ASSEMBLY Public/Granted day:2015-03-19
Information query