Invention Grant
- Patent Title: Inbred corn line MCB70
- Patent Title (中): 近交玉米线MCB70
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Application No.: US13917779Application Date: 2013-06-14
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Publication No.: US09585317B1Publication Date: 2017-03-07
- Inventor: Kermit B. Bohning
- Applicant: Agrigenetics, Inc.
- Applicant Address: US IN Indianapolis
- Assignee: Agrigenetics, Inc.
- Current Assignee: Agrigenetics, Inc.
- Current Assignee Address: US IN Indianapolis
- Agent Eric J. Kraus
- Main IPC: A01H5/10
- IPC: A01H5/10 ; A01G1/00

Abstract:
An inbred corn line, designated MCB70, the plants and seeds of the inbred corn line MCB70, methods for producing a corn plant, either inbred or hybrid, produced by crossing the inbred corn line MCB70 with itself or with another corn plant, and hybrid corn seeds and plants produced by crossing the inbred line MCB70 with another corn line or plant and to methods for producing a corn plant containing in its genetic material one or more transgenes and to the transgenic corn plants produced by that method. This invention also relates to inbred corn lines derived from inbred corn line MCB70, to methods for producing other inbred corn lines derived from inbred corn line MCB70 and to the inbred corn lines derived by the use of those methods.
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