Invention Grant
- Patent Title: Method and system of surface polishing
- Patent Title (中): 表面抛光方法和系统
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Application No.: US14095937Application Date: 2013-12-03
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Publication No.: US09586279B2Publication Date: 2017-03-07
- Inventor: Kangmin Hsia
- Applicant: Kangmin Hsia
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: B23H1/08
- IPC: B23H1/08 ; B23H1/02 ; B23H7/20 ; B23H9/02 ; B23H3/00 ; B23H7/32 ; B24B19/22 ; H01L21/306 ; B23H9/00 ; H01L21/66 ; B23H7/28 ; H01L21/3065 ; H01L21/3105 ; H01L21/321

Abstract:
A method of polishing a surface of an object disposed within a gas chamber is provided. The method includes filling the gas chamber with a discharging medium to a predefined pressure, applying a voltage between an electrode and the surface, calibrating a height of the electrode relative to the surface so as to establish electrical breakdown threshold criteria, and scanning the electrode with respect to the surface so as to sequentially position the electrode over a plurality of locations on the surface, each location characterized by a surface error. When a respective location in the plurality of locations has a surface error that meets the electrical breakdown threshold criteria, electrical breakdown occurs, whereby the electrical breakdown results in a discharging pulse that polishes the surface.
Public/Granted literature
- US20150075558A1 Method and System of Surface Polishing Public/Granted day:2015-03-19
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