Invention Grant
- Patent Title: Controlled-expansion CMP PAD casting method
- Patent Title (中): 控制膨胀CMP PAD铸造法
-
Application No.: US14576927Application Date: 2014-12-19
-
Publication No.: US09586304B2Publication Date: 2017-03-07
- Inventor: Bainian Qian , Andrew Wank , George C. Jacob
- Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Applicant Address: US DE Newark
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee Address: US DE Newark
- Agent Blake T. Biederman
- Main IPC: B24D3/00
- IPC: B24D3/00 ; B24D11/00 ; B24D18/00 ; C09K3/14 ; B24B1/00 ; B24B37/24 ; C08L75/04 ; C08G18/48 ; C08G18/72 ; C08G18/75 ; C08G18/76 ; C08G73/10 ; C08K7/22 ; C08L33/26
Abstract:
The invention provides a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method obtains a liquid polyurethane material formed from an isocyanate-terminated molecule and a curative agent. The liquid polyurethane material has a Tgel temperature and contains fluid-filled polymeric microspheres. The fluid-filled polymeric microspheres are a blend of preexpanded and unexpanded fluid-filled polymeric microspheres. The preexpanded and unexpanded fluid-filled polymeric microspheres each have a Tstart temperature where diameter of the preexpanded and unexpanded fluid-filled polymeric microspheres increases and a Tmax temperature where gas escapes to decrease diameter of the expanded and unexpanded fluid-filled polymeric microspheres. The cured polyurethane matrix contains preexpanded and expanded fluid-filled polymeric microspheres.
Public/Granted literature
- US20160176013A1 CONTROLLED-EXPANSION CMP PAD CASTING METHOD Public/Granted day:2016-06-23
Information query
