Invention Grant
- Patent Title: Chemical mechanical polishing pad and method of making same
- Patent Title (中): 化学机械抛光垫及其制作方法
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Application No.: US14751340Application Date: 2015-06-26
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Publication No.: US09586305B2Publication Date: 2017-03-07
- Inventor: Bainian Qian , Julia Kozhukh , Teresa Brugarolas Brufau , David Michael Veneziale , Yuhua Tong , Diego Lugo , Jeffrey B. Miller , George C. Jacob , Marty W. DeGroot , Tony Quan Tran , Marc R. Stack , Andrew Wank , Fengji Yeh
- Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc. , Dow Global Technologies LLC
- Applicant Address: US DE Newark US MI Midland
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.,Dow Global Technologies LLC
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.,Dow Global Technologies LLC
- Current Assignee Address: US DE Newark US MI Midland
- Agent Thomas S. Deibert; Andrew Merriam
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B24B53/017 ; H01L21/306 ; G02B1/12 ; H01F41/00 ; B24D18/00 ; B24D11/00 ; C08J9/00 ; C08G18/00
Abstract:
A chemical mechanical polishing pad is provided, comprising: a chemical mechanical polishing layer having a polishing surface; wherein the chemical mechanical polishing layer is formed by combining (a) a poly side (P) liquid component, comprising: an amine-carbon dioxide adduct; and, at least one of a polyol, a polyamine and a alcohol amine; and (b) an iso side (I) liquid component, comprising: polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of ≧10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of
Public/Granted literature
- US20160375543A1 CHEMICAL MECHANICAL POLISHING PAD AND METHOD OF MAKING SAME Public/Granted day:2016-12-29
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