Invention Grant
- Patent Title: Composite laminate thickness compensation
- Patent Title (中): 复合层压板厚度补偿
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Application No.: US12264757Application Date: 2008-11-04
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Publication No.: US09586367B2Publication Date: 2017-03-07
- Inventor: Jeffrey T. Drewett , Paul T. Briney , Grady L. White , Gary L. Kelly , Michael L. Hestness , Todd H. Ashton , Peter L. Morken
- Applicant: Jeffrey T. Drewett , Paul T. Briney , Grady L. White , Gary L. Kelly , Michael L. Hestness , Todd H. Ashton , Peter L. Morken
- Applicant Address: US MD Bethesda
- Assignee: LOCKHEED MARTIN CORPORATION
- Current Assignee: LOCKHEED MARTIN CORPORATION
- Current Assignee Address: US MD Bethesda
- Agency: Bracewell LLP
- Agent James E. Bradley; Brad Y. Chin
- Main IPC: B29C70/54
- IPC: B29C70/54 ; B29C73/10
Abstract:
A method is provided for the non-contact measurement of variations in thickness of composite materials and structures prepared from composite parts. Metrologic methods are employed to provide a 3D image of the structure or part. Variations that are greater than an acceptable amount can be corrected by adding a compensation layer to the surface of the structure or part.
Public/Granted literature
- US20100112190A1 COMPOSITE LAMINATE THICKNESS COMPENSATION Public/Granted day:2010-05-06
Information query
