Invention Grant
- Patent Title: Bonding station for two different bonding processes
- Patent Title (中): 焊接站用于两种不同的焊接工艺
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Application No.: US14158437Application Date: 2014-01-17
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Publication No.: US09586377B2Publication Date: 2017-03-07
- Inventor: Jürgen Hanten
- Applicant: Poly-clip System GmbH & Co. KG
- Applicant Address: DE Hattersheim
- Assignee: Poly-clip System GmbH & Co.
- Current Assignee: Poly-clip System GmbH & Co.
- Current Assignee Address: DE Hattersheim
- Agency: Fitch, Even, Tabin & Flannery LLP
- Priority: EP13151908 20130118
- Main IPC: B31F5/00
- IPC: B31F5/00 ; A22C13/00 ; B29C53/38

Abstract:
The invention concerns a method and an apparatus for producing a tubular packaging casing, wherein a film web is fed in a feeding direction to forming means for forming a tubular casing having edge areas which extend in the feeding direction and which are arranged adjacent to each other, and wherein the edge areas are bonded together in a bonding station having one bonding tool. Moreover, the bonding tool can be moved in a first and a second working position for carrying out two alternative processes of firmly bonding in one of each of the working positions for bonding the edge areas of the tubular casing together.
Public/Granted literature
- US20140206515A1 BONDING STATION FOR TWO DIFFERENT BONDING PROCESSES Public/Granted day:2014-07-24
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