Invention Grant
- Patent Title: Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head
- Patent Title (中): 液体喷射头,液体喷射装置和液体喷射头的制造方法
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Application No.: US14645948Application Date: 2015-03-12
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Publication No.: US09586402B2Publication Date: 2017-03-07
- Inventor: Yuko Komatsu , Ryota Kinoshita , Fumiya Takino
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2014-072629 20140331
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/155

Abstract:
A liquid ejecting head comprising: a head body that ejects liquid droplets from a liquid ejecting surface; a wiring substrate electrically connected to the head body; a holder member to which the head bodies are fixed, and that includes a flow channel to the head bodies, and a wiring through hole through which the wiring substrate passes; a circuit substrate that includes a connection portion electrically connected to the wiring substrate, and a substrate that arranges the connection portion on both surfaces thereof and stands in a direction intersecting the liquid ejecting surface; a set of a first correction plate facing each other with respect to each of both surfaces of the substrate of the circuit substrate for correcting the holder member; and a cover member that accommodates the circuit substrate fixed to the holder member and the first correction plate.
Public/Granted literature
- US20150273826A1 LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND METHOD OF MANUFACTURING LIQUID EJECTING HEAD Public/Granted day:2015-10-01
Information query
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