Invention Grant
- Patent Title: Heat sink and mounting bracket arrangement
- Patent Title (中): 散热器和安装支架安装
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Application No.: US14590675Application Date: 2015-01-06
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Publication No.: US09587891B2Publication Date: 2017-03-07
- Inventor: Tsung-Hsien Huang
- Applicant: Tsung-Hsien Huang
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Priority: CN201410629304 20141111
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F3/02 ; F28F9/007 ; F28D15/02 ; F28F1/32 ; H01L23/40 ; H01L23/367 ; H01L23/427

Abstract:
A heat sink and mounting bracket arrangement includes a radiation fin module including a stack of radiation fins and an insertion hole located in one end of the stack of radiation fins, and a mounting bracket made from a metal plate sheet by stamping and including a bottom panel clamped on a bottom wall of the stack of radiation fins, an angled mounting panel rearwardly extending from one end of the bottom panel, a mounting slot cut through opposing top and bottom surfaces of the mounting panel for the mounting of a fastening member to affix the mounting bracket to an external substrate, and an angled plug plate forwardly extending from the bottom panel and tightly press-fitted into the insertion hole of the radiation fin module.
Public/Granted literature
- US20160131442A1 HEAT SINK AND MOUNTING BRACKET ARRANGEMENT Public/Granted day:2016-05-12
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