Invention Grant
- Patent Title: Airflow measuring apparatus including a ventilation hole between a connector part and a circuit chamber
- Patent Title (中): 气流测量装置包括连接器部分和电路室之间的通气孔
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Application No.: US14363235Application Date: 2011-12-07
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Publication No.: US09587970B2Publication Date: 2017-03-07
- Inventor: Takeshi Morino , Shinobu Tashiro , Noboru Tokuyasu , Ryosuke Doi , Keiji Hanzawa
- Applicant: Takeshi Morino , Shinobu Tashiro , Noboru Tokuyasu , Ryosuke Doi , Keiji Hanzawa
- Applicant Address: JP Hitachinaka-shi
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi
- Agency: Foley & Lardner LLP
- International Application: PCT/JP2011/006833 WO 20111207
- International Announcement: WO2013/084259 WO 20130613
- Main IPC: G01F1/68
- IPC: G01F1/68 ; G01F1/684 ; G01F1/692 ; G01F5/00 ; F02D41/18 ; H01L35/34

Abstract:
An airflow measuring apparatus includes a sub-passage that takes in part of flow of fluid flowing through an intake pipe, a sensor element disposed in the sub-passage to measure the flow of fluid, a circuit part converting the flow of fluid detected by the sensor element into an electric signal, a connector part connected to the circuit part to output a signal externally, and a casing supporting the sensor element and the circuit part. The sensor element is disposed in the intake pipe, and includes a cavity disposed at a semiconductor substrate and a diaphragm including a thin film part that covers the cavity. The sensor element on a lead frame has surfaces that are mold-packaged with resin so that the diaphragm and part of the lead frame are exposed. One hole is disposed at the lead frame for communication between the cavity and exterior.
Public/Granted literature
- US20140352424A1 AIRFLOW MEASURING APPARATUS Public/Granted day:2014-12-04
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