Invention Grant
- Patent Title: Measurement apparatus and method of measurement
- Patent Title (中): 测量装置和测量方法
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Application No.: US14680380Application Date: 2015-04-07
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Publication No.: US09588072B2Publication Date: 2017-03-07
- Inventor: Yuki Kawamuro , Nobuhisa Handa , Tetsuya Takahashi
- Applicant: HIOKI DENKI KABUSHIKI KAISHA
- Applicant Address: JP Nagano
- Assignee: HIOKI DENKI KABUSHIKI KAISHA
- Current Assignee: HIOKI DENKI KABUSHIKI KAISHA
- Current Assignee Address: JP Nagano
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-082578 20140414; JP2014-131963 20140627; JP2015-003797 20150113
- Main IPC: G01R31/26
- IPC: G01R31/26 ; C12M1/00 ; G01N27/04

Abstract:
A measurement apparatus includes a measuring unit that carries out a potential measuring process that measures potential at measured positions on a surface of a laminated body, in which a plurality of plate-like or film-like component parts with different physical properties have been laminated, in a state where an electrical signal has been supplied to the surface, and a processing unit that carries out a computational process, which has been decided in advance, using measurement values of the potential that have been measured by the potential measuring process to find an interfacial resistance of an interface between the component parts in the laminated body.
Public/Granted literature
- US20150293043A1 MEASUREMENT APPARATUS AND METHOD OF MEASUREMENT Public/Granted day:2015-10-15
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