An inspection probe 16Ai is formed by subjecting a thin sheet material made of a copper alloy to press working. The inspection probe 16Ai includes: a device side plunger 16A having a contact point which selectively comes into contact with an electrode portion DVb of a semiconductor device DV; a board side plunger 16B having a contact point which selectively comes into contact with a contact pad of a printed wiring board 18; a spring portion 16D which biases the device side plunger 16A and the board side plunger 16B in a direction away from each other; and a cylindrical support stem 16C being disposed inside the spring portion 16D, making the spring portion 16D slidable thereon, and being configured to retain straight advancing property of the spring portion 16D.