Invention Grant
- Patent Title: System and method for testing an integrated circuit
- Patent Title (中): 用于测试集成电路的系统和方法
-
Application No.: US13472666Application Date: 2012-05-16
-
Publication No.: US09588171B2Publication Date: 2017-03-07
- Inventor: Nikolay Ilkov , Winfried Bakalski
- Applicant: Nikolay Ilkov , Winfried Bakalski
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/26 ; G01R31/28

Abstract:
In accordance with an embodiment, a method of testing an integrated circuit, includes receiving a supply voltage on the integrated circuit via a first input pin, providing power to circuits disposed on the integrated circuit via the first input pin, comparing the supply voltage to an internally generated voltage, generating a digital output value based on the comparing, and applying the digital output value to a pin of the integrated circuit.
Public/Granted literature
- US20130307576A1 System and Method for Testing an Integrated Circuit Public/Granted day:2013-11-21
Information query