Invention Grant
- Patent Title: Photomask pattern and method for forming the same
- Patent Title (中): 光掩模图案及其形成方法
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Application No.: US14332565Application Date: 2014-07-16
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Publication No.: US09588414B2Publication Date: 2017-03-07
- Inventor: Tiezhu Wang
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN Shanghai
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee Address: CN Shanghai
- Agency: Anova Law Group, PLLC
- Priority: CN201310745658 20131230
- Main IPC: G03F1/38
- IPC: G03F1/38

Abstract:
Various embodiments provide photomask patterns and methods for forming the same. In an exemplary method, a to-be-etched pattern can be provided. The to-be-etched pattern can be divided into a first mask pattern and an initial second mask pattern. The first mask pattern can include one or more first patterns and the initial second mask pattern can include one or more second patterns. A second print scattering pattern can be formed and added to the initial second mask pattern. A position of the second print scattering pattern can be separated from a position of the one or more first patterns of the first mask pattern.
Public/Granted literature
- US20150185600A1 PHOTOMASK PATTERN AND METHOD FOR FORMING THE SAME Public/Granted day:2015-07-02
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