Invention Grant
- Patent Title: Array of processor core circuits with reversible tiers
- Patent Title (中): 具有可逆层的处理器核心电路阵列
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Application No.: US13781465Application Date: 2013-02-28
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Publication No.: US09588937B2Publication Date: 2017-03-07
- Inventor: Rodrigo Alvarez-Icaza Rivera , John V. Arthur , John E. Barth, Jr. , Andrew S. Cassidy , Subramanian S. Iyer , Bryan L. Jackson , Paul A. Merolla , Dharmendra S. Modha , Jun Sawada
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Sherman IP LLP
- Agent Kenneth L. Sherman; Hemavathy Perumal
- Main IPC: G06F13/38
- IPC: G06F13/38 ; G06F15/78 ; G06F15/173

Abstract:
Embodiments of the invention relate to an array of processor core circuits with reversible tiers. One embodiment comprises multiple tiers of core circuits and multiple switches for routing packets between the core circuits. Each tier comprises at least one core circuit. Each switch comprises multiple router channels for routing packets in different directions relative to the switch, and at least one routing circuit configured for reversing a logical direction of at least one router channel.
Public/Granted literature
- US20140244971A1 ARRAY OF PROCESSOR CORE CIRCUITS WITH REVERSIBLE TIERS Public/Granted day:2014-08-28
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