Invention Grant
- Patent Title: Semiconductor device and layout method thereof
- Patent Title (中): 半导体器件及其布局方法
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Application No.: US14722714Application Date: 2015-05-27
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Publication No.: US09589094B2Publication Date: 2017-03-07
- Inventor: Szu-Lin Liu , Jaw-Juinn Horng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In some embodiments, a semiconductor device includes a cell array, a first region and a second region. The first region surrounds the cell array and has a first pattern density. The second region is between the cell array and the first region. The second region surrounds the cell array and has a second pattern density smaller than a third pattern density of the cell array, which in turn is smaller than the first pattern density.
Public/Granted literature
- US20160292339A1 SEMICONDUCTOR DEVICE AND LAYLOUT METHOD THEREOF Public/Granted day:2016-10-06
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