Invention Grant
- Patent Title: Chip electronic component and method of manufacturing the same
- Patent Title (中): 芯片电子部件及其制造方法
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Application No.: US14259053Application Date: 2014-04-22
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Publication No.: US09589724B2Publication Date: 2017-03-07
- Inventor: Min Sung Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0132914 20131104
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01F41/04 ; H01F17/00 ; H01F17/04 ; H01F27/29
Abstract:
A chip electronic component may include an insulating layer formed on a lower portion of a side surface of an internal coil pattern to avoid a direct contact between the internal coil pattern and a magnetic material, thereby preventing a waveform distortion indicating a reduction in inductance at high frequency.
Public/Granted literature
- US20150123757A1 CHIP ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-05-07
Information query
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