Invention Grant
- Patent Title: Multilayer ceramic capacitor, mounting circuit board thereof, and manufacturing method of the same
- Patent Title (中): 多层陶瓷电容器及其安装电路板及其制造方法
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Application No.: US14067543Application Date: 2013-10-30
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Publication No.: US09589725B2Publication Date: 2017-03-07
- Inventor: Sang Soo Park , Heung Kil Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0079098 20130705
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/06 ; H01G4/232

Abstract:
There is provided a multilayer ceramic capacitor including, a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed through the double side surfaces facing each other in a width direction, having the dielectric layers therebetween, and first and second external electrodes formed on the surfaces of the ceramic body in the width and thickness directions and electrically connected to the first and second internal electrodes, wherein when a length of the ceramic body is defined as L and a width of the ceramic body is defined as W, a ratio L/W of the length L to the width W of the ceramic body satisfies 1.39≦L/W≦2.12.
Public/Granted literature
- US20150008025A1 MULTILAYER CERAMIC CAPACITOR, MOUNTING CIRCUIT BOARD THEREOF, AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2015-01-08
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