Invention Grant
- Patent Title: Method for polishing a polymer surface
- Patent Title (中): 抛光聚合物表面的方法
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Application No.: US14689067Application Date: 2015-04-17
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Publication No.: US09589786B2Publication Date: 2017-03-07
- Inventor: Ting Li , Haiyang Gu
- Applicant: National Center for Advanced Packaging Co., Ltd.
- Applicant Address: CN Wuxi
- Assignee: National Center for Advanced Packaging Co., Ltd
- Current Assignee: National Center for Advanced Packaging Co., Ltd
- Current Assignee Address: CN Wuxi
- Agency: Flener IP Law
- Agent Zareefa B. Flener
- Priority: CN201410173271 20140428; CN201410174848 20140428; CN201410174849 20140428
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; H01L21/02 ; H01L21/3105 ; H01L21/321 ; H01L21/56 ; H01L21/768
Abstract:
A method for polishing a polymer surface is provided by an embodiment of the present invention. The method includes: curing the polymer surface; polishing the polymer surface cured through a CMP process. By using the method for polishing a polymer surface provided by embodiments of the present invention, the mentioned problems in the prior art are solved. The uniformity of the polymer surface can be improved to
Public/Granted literature
- US20150311093A1 Method for Polishing a Polymer Surface Public/Granted day:2015-10-29
Information query
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