Invention Grant
- Patent Title: Method of defining poly-silicon growth direction
- Patent Title (中): 定义多晶硅生长方向的方法
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Application No.: US14348873Application Date: 2014-01-21
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Publication No.: US09589796B2Publication Date: 2017-03-07
- Inventor: Wei Yu
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201310747070 20131230
- International Application: PCT/CN2014/070963 WO 20140121
- International Announcement: WO2015/100817 WO 20150709
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/3065 ; H01L21/308

Abstract:
The present invention relates to a method of defining poly-silicon growth direction. The method of defining poly-silicon growth direction comprises Step 1, forming a buffer layer on a substrate; Step 2, forming an amorphous silicon thin film on the buffer layer; Step 3, forming regular amorphous silicon convex portions on the amorphous silicon thin film; and Step 4, transferring the amorphous silicon thin film into poly-silicon with an excimer laser anneal process. The growth direction of the poly-silicon as being formed can be controlled according to the present method of defining poly-silicon growth direction. Accordingly, the grain size of the poly-silicon can be raised.
Public/Granted literature
- US20150249006A1 METHOD OF DEFINING POLY-SILICON GROWTH DIRECTION Public/Granted day:2015-09-03
Information query
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