Invention Grant
- Patent Title: Interconnect arrangement for hexagonal attachment configurations
- Patent Title (中): 用于六边形附件配置的互连装置
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Application No.: US13993334Application Date: 2011-12-22
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Publication No.: US09589919B2Publication Date: 2017-03-07
- Inventor: Raul Enriquez Shibayama , Jimmy A. Johansson , Kai Xiao
- Applicant: Raul Enriquez Shibayama , Jimmy A. Johansson , Kai Xiao
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- International Application: PCT/US2011/066767 WO 20111222
- International Announcement: WO2013/095492 WO 20130627
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01L23/00 ; H01L23/498 ; H05K1/02 ; H05K1/11 ; H05K3/34
Abstract:
The present description relates to the field of fabricating microelectronic devices, wherein a microelectronic device may have a hexagonal confirmation for signal nodes and ground nodes which utilizes the cross-talk reduction by cancellation property of geometrically symmetry and orthogonality to reduce signal node to ground node ratio for increasing signaling density.
Public/Granted literature
- US20140140027A1 INTERCONNECT ARRANGEMENT FOR HEXAGONAL ATTACHMENT CONFIGURATIONS Public/Granted day:2014-05-22
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