Invention Grant
- Patent Title: Chip with a bump connected to a plurality of wirings
- Patent Title (中): 具有连接到多个布线的凸块的芯片
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Application No.: US14844602Application Date: 2015-09-03
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Publication No.: US09589946B2Publication Date: 2017-03-07
- Inventor: Maya Inagaki , Masaru Koyanagi , Mikihiko Ito
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Minato-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/48 ; H01L23/522 ; H01L23/538 ; H01L23/528 ; H01L23/00
Abstract:
According to one embodiment, a semiconductor device includes a first semiconductor chip; a first wiring and a second wiring which are provided above a first surface of the first semiconductor chip; a first terminal connected to one end of the first wiring and one end of the second wiring, and connected to an outside; a second terminal connected to the other end of the first wiring; and a third terminal connected to the other end of the second wiring, and connected to the second terminal.
Public/Granted literature
- US20160322341A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-11-03
Information query
IPC分类:
