Invention Grant
- Patent Title: Semiconductor structure
- Patent Title (中): 半导体结构
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Application No.: US14960430Application Date: 2015-12-06
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Publication No.: US09590041B1Publication Date: 2017-03-07
- Inventor: Yu-Ru Yang , Huai-Tzu Chiang , Sheng-Hao Lin , Shih-Hsien Huang , Chien-Hung Chen , Chun-Yuan Wu , Cheng-Tzung Tsai
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: CN201510724668 20151030
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/10 ; H01L29/78 ; H01L29/165 ; H01L29/778 ; H01L27/092

Abstract:
A semiconductor structure includes a semiconductor substrate, a dielectric structure formed on the semiconductor substrate and including at least a recess formed therein, a fin formed in the recess, and a dislocation region formed in the fin. The semiconductor substrate includes a first semiconductor material. The fin includes the first semiconductor material and a second semiconductor material. A lattice constant of the second semiconductor material is different from a lattice constant of the first semiconductor material. A topmost portion of the dislocation region is higher than an opening of the recess.
Information query
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