Invention Grant
- Patent Title: Reduced parasitic capacitance with slotted contact
- Patent Title (中): 降低寄生电容与开槽接触
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Application No.: US14242909Application Date: 2014-04-02
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Publication No.: US09590057B2Publication Date: 2017-03-07
- Inventor: Effendi Leobandung
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent John W. Hayes; Brian M. Restauro
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/78 ; H01L29/66

Abstract:
A FET device fabricated by providing a first conductor on a substrate, the first conductor having a first top surface with a first height above the substrate. A second conductor is provided adjacent the first conductor, the second conductor having a second top surface with a second height above the substrate. A portion of the second conductor is removed to provide a slot, wherein the slot is defined by opposing interior sidewalls and a bottom portion, such that the bottom portion of the slot is below the first height of the first conductor. An insulating material is deposited in the slot, the insulating material having a third top surface with a third height above the substrate, the third height being below the second height of the second conductor to provide space within the slot for a third conductor. The space within the slot is then filled with the third conductor.
Public/Granted literature
- US20150287796A1 REDUCED PARASITIC CAPACITANCE WITH SLOTTED CONTACT Public/Granted day:2015-10-08
Information query
IPC分类: