Invention Grant
- Patent Title: Insulating block in a semiconductor trench
- Patent Title (中): 绝缘块在半导体沟槽中
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Application No.: US15043990Application Date: 2016-02-15
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Publication No.: US09590062B2Publication Date: 2017-03-07
- Inventor: Li Juin Yip , Martin Henning Vielemeyer
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102015202764 20150216
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L29/40 ; H01L29/423

Abstract:
A semiconductor device is produced by: creating an opening in a mask formed on a semiconductor body; creating, underneath the opening, a trench in the semiconductor body which has a side wall and a trench bottom; creating, while the mask is on the semiconductor body, an insulating layer covering the trench bottom and the side wall; depositing a spacer layer including a first electrode material on the insulating layer; removing the spacer layer from at least a portion of the insulating layer that covers the trench bottom; filling at least a portion of the trench with an insulating material; removing the part of the insulating material laterally confined by the spacer layer so as to leave an insulating block in the trench; and filling at least a portion of the trench with a second electrode material so as to form an electrode within the trench.
Public/Granted literature
- US20160240621A1 Insulating Block in a Semiconductor Trench Public/Granted day:2016-08-18
Information query
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