Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14873617Application Date: 2015-10-02
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Publication No.: US09590114B1Publication Date: 2017-03-07
- Inventor: Yu-Cheng Tung
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW104128325A 20150828
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/786 ; H01L29/66 ; H01L29/423

Abstract:
A semiconductor device is provided, comprising a substrate with a first insulating film formed thereon, and a transistor formed on the first insulating film. The transistor at least comprises an oxide semiconductor layer formed on the first insulating film, a first gate insulation film formed on the oxide semiconductor layer, a gate electrode formed above the first gate insulation film, and spacers formed on the oxide semiconductor layer. The spacers at least cover the sidewalls of the first gate insulation film and the sidewalls of the gate electrode. The gate electrode has a gate width and the first gate insulation film has a first width, wherein the gate width is different from the first width.
Public/Granted literature
- US20170062618A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-03-02
Information query
IPC分类: