Invention Grant
- Patent Title: Connector housing
- Patent Title (中): 连接器外壳
-
Application No.: US14741926Application Date: 2015-06-17
-
Publication No.: US09590365B2Publication Date: 2017-03-07
- Inventor: Hongwen Yang , Jian Zhou , Weixiang Ding , Yangrong Xue , Jingwei Shao , Xinbo Liu
- Applicant: Tyco Electronics (Shanghai) Co. Ltd.
- Applicant Address: CN Shanghai
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Barley Snyder
- Priority: CN201410269546 20140617
- Main IPC: H01R13/6587
- IPC: H01R13/6587 ; H01R13/659

Abstract:
The present invention discloses a connector housing comprising: an upper housing portion; a lower housing portion located below the upper housing portion; and at least three partition members located an inner space defined by the upper housing portion and the lower housing portion for partitioning the inner space into at least four insertion ports. At least one pair of the at least three partition members are connected to each other through a connecting plate so as to form a frame part in a general “” shape; and the connecting plate is stacked onto a corresponding bottom of the lower housing portion. Thus, the amount of the partition members forming the connector housing is reduced, the structural strength of the entire connector housing may be increased, and a dimensional accuracy of each insertion port is reliably ensured.
Public/Granted literature
- US20150364870A1 Connector Housing Public/Granted day:2015-12-17
Information query
IPC分类: