Invention Grant
- Patent Title: High capacity power distribution panel for a modular data center
- Patent Title (中): 用于模块化数据中心的大容量配电盘
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Application No.: US15013485Application Date: 2016-02-02
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Publication No.: US09590404B2Publication Date: 2017-03-07
- Inventor: Mark M. Bailey , Ty R. Schmitt
- Applicant: Dell Products, LP
- Applicant Address: US TX Round Rock
- Assignee: DELL PRODUCTS, LP
- Current Assignee: DELL PRODUCTS, LP
- Current Assignee Address: US TX Round Rock
- Agency: Larson Newman, LLP
- Main IPC: H02G5/00
- IPC: H02G5/00 ; G06F1/18 ; H05K7/14

Abstract:
A power distribution network includes a first busway, a second busway situated between the first busway and a load, a first bus plug, and a second bus plug. The first and second bus plugs are configured to span across the first busway and the second busway. The first bus plug is further configured to provide power from the first busway to the load via an exit from the first bus plug that is adjacent to the load. The second bus plug is further configured to provide power from the second busway to the load via an exit from the second bus plug that is adjacent to the first load.
Public/Granted literature
- US20160149387A1 High Capacity Power Distribution Panel for a Modular Data Center Public/Granted day:2016-05-26
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