Invention Grant
- Patent Title: Camera module having support boss
- Patent Title (中): 相机模块有支撑架
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Application No.: US14588479Application Date: 2015-01-02
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Publication No.: US09591191B2Publication Date: 2017-03-07
- Inventor: Sang Ok Park , Seong Min Lee , Jun Taek Lee
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2014-0000567 20140103; KR10-2014-0001785 20140107; KR10-2014-0001789 20140107; KR10-2014-0001796 20140107; KR10-2014-0001802 20140107
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
A camera module according to an exemplary embodiment of the present disclosure is proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a housing member arranged at an upper surface of the PCB, a bobbin movably positioned at an inner side of the housing member, an upper elastic member connected to an upper surface of the housing member and to an upper surface of the bobbin, and a space forming part formed at one side of the housing member to provide a moving space to the upper elastic member when the bobbin makes a relatively vertical movement to the housing member.
Public/Granted literature
- US20150195438A1 CAMERA MODULE Public/Granted day:2015-07-09
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