Invention Grant
- Patent Title: Circuit board
- Patent Title (中): 电路板
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Application No.: US14740360Application Date: 2015-06-16
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Publication No.: US09591759B2Publication Date: 2017-03-07
- Inventor: Chu-Li Wang
- Applicant: EMCOM TECHNOLOGY INC.
- Applicant Address: TW Taipei
- Assignee: EMCOM TECHNOLOGY INC.
- Current Assignee: EMCOM TECHNOLOGY INC.
- Current Assignee Address: TW Taipei
- Priority: TW104116527A 20150522
- Main IPC: H01P1/00
- IPC: H01P1/00 ; H05K1/16 ; H01R13/6464

Abstract:
A circuit board for a communication connector, comprising a first signal input terminal, a first signal output terminal, a second signal input terminal, a second signal output terminal, a first signal wire, a second signal wire, a capacitive structure and a capacitive cylinder. The first signal input terminal and the first signal output terminal are coupled by the first signal wire; the second signal input terminal and the second signal output terminal are coupled by the second signal wire; the capacitive structure is coupled with the first signal wire; the capacitive cylinder is coupled with second signal wire. The capacitive structure and the capacitive cylinder are capacitive coupled between the first signal wire and the second signal wire.
Public/Granted literature
- US20160344363A1 CIRCUIT BOARD Public/Granted day:2016-11-24
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