Invention Grant
- Patent Title: Substrate with embedded component
- Patent Title (中): 基板与嵌入式组件
-
Application No.: US15068706Application Date: 2016-03-14
-
Publication No.: US09591763B2Publication Date: 2017-03-07
- Inventor: Mitsunori Abe , Kiyoyuki Hatanaka , Nobuo Taketomi , Shigeo Iriguchi , Ryo Kanai , Naoki Nakamura
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Limited Center
- Priority: JP2015-091189 20150428
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/11 ; H05K1/18 ; H05K1/09 ; H05K1/03 ; H05K3/46 ; H05K1/02 ; H05K3/00
Abstract:
Disclosed substrate with embedded component includes: an insulating base member; a conductive pad formed on the insulating base member; a component connected to the conductive pad with a solder; and a resin covering the component, wherein a hole is provided in the insulating base member and the conductive pad, and the insulating base member is exposed on a side surface of the hole.
Public/Granted literature
- US20160324005A1 SUBSTRATE WITH EMBEDDED COMPONENT Public/Granted day:2016-11-03
Information query
