Invention Grant
- Patent Title: Multiple-backplane implementations for modular platforms
- Patent Title (中): 模块化平台的多背板实现
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Application No.: US14528488Application Date: 2014-10-30
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Publication No.: US09591784B2Publication Date: 2017-03-07
- Inventor: Matthew A. Butterbaugh , Eric A. Eckberg , Camillo Sassano , Kevin L. Schultz , George W. Van Leeuwen
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Patterson + Sheridan, LLP
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
A chassis for mounting sub-rack modular units is disclosed that includes a frame defining a forward opening through which modular units are inserted to attach to the frame, a first backplane attached to the frame and that operates to provide a first functionality to one or more attached modular units that are coupled to connectors of the first backplane, and a second backplane attached to the frame and that operates to provide a second functionality to one or more attached modular units that are coupled to connectors of the second backplane, wherein the second functionality is different than the first functionality.
Public/Granted literature
- US20160128221A1 MULTIPLE-BACKPLANE IMPLEMENTATIONS FOR MODULAR PLATFORMS Public/Granted day:2016-05-05
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