Invention Grant
- Patent Title: Packaged solid object and method for manufacturing thereof
- Patent Title (中): 包装固体及其制造方法
-
Application No.: US13991904Application Date: 2011-11-30
-
Publication No.: US09592946B2Publication Date: 2017-03-14
- Inventor: Yutaka Sekiba , Yasuhiro Hayashi
- Applicant: Yutaka Sekiba , Yasuhiro Hayashi
- Applicant Address: JP Tokyo
- Assignee: MEIJI CO., LTD.
- Current Assignee: MEIJI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Pyprus Pte Ltd
- Priority: JP2010-272032 20101206
- International Application: PCT/JP2011/077723 WO 20111130
- International Announcement: WO2012/077560 WO 20120614
- Main IPC: B65D81/28
- IPC: B65D81/28 ; B65D81/20 ; A23L3/3409 ; B65B31/04
Abstract:
A packaged product which comprises a solid object and a packaging that seals and holds the solid object, wherein a replacement gas is contained in a space sealed by the packaging when the packaging is sealed and wherein the solid object has absorbed a part of or all of the replacement gas.
Public/Granted literature
- US20130292273A1 Packaged Solid Object And Method For Manufacturing Thereof Public/Granted day:2013-11-07
Information query
