Invention Grant
- Patent Title: Electrochemical deposition method
- Patent Title (中): 电化学沉积法
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Application No.: US15180477Application Date: 2016-06-13
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Publication No.: US09593430B2Publication Date: 2017-03-14
- Inventor: Junichiro Yoshioka , Kuniaki Horie , Yugang Guo , Satoshi Morikami
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2002-213208 20020722; JP2002-213209 20020722
- Main IPC: C25D17/00
- IPC: C25D17/00 ; C25D7/12 ; H01L21/687 ; H01L21/683 ; H01L21/288 ; H01L23/00 ; C25D17/06 ; C25D21/12 ; H01L21/67 ; C25D17/08 ; H01L21/768
Abstract:
The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
Public/Granted literature
- US20160319456A1 ELECTROCHEMICAL DEPOSITION METHOD Public/Granted day:2016-11-03
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