Invention Grant
- Patent Title: Sensor probe
- Patent Title (中): 传感器探头
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Application No.: US14267367Application Date: 2014-05-01
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Publication No.: US09593984B2Publication Date: 2017-03-14
- Inventor: Jeffrey N. Arensmeier
- Applicant: Emerson Electric Co.
- Applicant Address: US MO St. Louis
- Assignee: EMERSON ELECTRIC CO.
- Current Assignee: EMERSON ELECTRIC CO.
- Current Assignee Address: US MO St. Louis
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: G01K13/02
- IPC: G01K13/02 ; G01K1/08 ; G01K7/22

Abstract:
A sensor probe may include an elongated body and a temperature sensor. The elongated body may include at least one first aperture, a first passageway and a second passageway. The first passageway may be in communication with the first aperture and may extend along a longitudinal axis of the elongated body. The second passageway may be in communication with and may extend from the first passageway. The temperature sensor may be disposed within the first passageway and may include a wire extending through a portion of the first passageway and the second passageway. The wire may include a diameter that is less than a diameter of the first passageway such that the first passageway defines a pressure path around the wire.
Public/Granted literature
- US20140334525A1 SENSOR PROBE Public/Granted day:2014-11-13
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