Invention Grant
- Patent Title: Processing apparatus, processing method, and device manufacturing method
- Patent Title (中): 处理装置，处理方法和装置制造方法
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Application No.: US14834742Application Date: 2015-08-25
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Publication No.: US09594312B2Publication Date: 2017-03-14
- Inventor: Shinichi Hirano
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2014-175448 20140829
- Main IPC: G03B27/58
- IPC: G03B27/58 ; G03B27/60 ; G03F7/20 ; H01L21/683 ; G03F7/32 ; H01L21/677 ; H01L21/687
Abstract:
A processing apparatus that performs processing to a wafer is provided, the processing apparatus comprising a wafer chuck disposed on a stage and that holds the wafer; three pins that attract the wafer and move the wafer from the wafer chuck; and a control unit that is configured to stop or decrease the attraction of the three pins based on information about a through hole of the wafer when the wafer is moved from the wafer chuck by the three pins.
Public/Granted literature
- US20160064266A1 PROCESSING APPARATUS, PROCESSING METHOD, AND DEVICE MANUFACTURING METHOD Public/Granted day:2016-03-03
Information query
