Invention Grant
- Patent Title: Scaling voltages in relation to die location
- Patent Title (中): 相对于模具位置调整电压
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Application No.: US15009896Application Date: 2016-01-29
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Publication No.: US09594868B1Publication Date: 2017-03-14
- Inventor: Eric A. Foreman , Nazmul Habib , Kerim Kalafala
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Christopher McLane
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
The method includes identifying, by one or more computer processors, a location that corresponds to an integrated circuit chip on a wafer. The method further includes identifying, by one or more computer processors, an on-chip variation of the integrated circuit chip. The method further includes determining, by one or more computer processes, a desired voltage for the integrated circuit chip based upon the identified on-chip variation of the integrated circuit chip. The method further includes adjusting, by one or more computer processors, the voltage of the integrated circuit chip via a voltage regulated on the integrated circuit chip based upon the determined desired voltage.
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