Invention Grant
US09594868B1 Scaling voltages in relation to die location 有权
相对于模具位置调整电压

Scaling voltages in relation to die location
Abstract:
The method includes identifying, by one or more computer processors, a location that corresponds to an integrated circuit chip on a wafer. The method further includes identifying, by one or more computer processors, an on-chip variation of the integrated circuit chip. The method further includes determining, by one or more computer processes, a desired voltage for the integrated circuit chip based upon the identified on-chip variation of the integrated circuit chip. The method further includes adjusting, by one or more computer processors, the voltage of the integrated circuit chip via a voltage regulated on the integrated circuit chip based upon the determined desired voltage.
Information query
Patent Agency Ranking
0/0