Invention Grant
- Patent Title: Wireless charging coil PCB structure
- Patent Title (中): 无线充电线圈PCB结构
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Application No.: US14605601Application Date: 2015-01-26
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Publication No.: US09595383B2Publication Date: 2017-03-14
- Inventor: Feng-Lung Chien , Takahiro Oishi , Chris T Burket , Chao-Neen Chang , Alan Wu
- Applicant: TDK TAIWAN Corporation
- Applicant Address: TW Taipei
- Assignee: TDK TAIWAN CORPORATION
- Current Assignee: TDK TAIWAN CORPORATION
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW103137760A 20141031
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F38/14 ; H02J5/00 ; H02J7/02 ; H02J7/00

Abstract:
A wireless charging coil PCB structure includes a first coil disposed on a first layer of PCB, where a center or peripheral of the first coil is a first non-coil region; a second coil disposed on a second layer of PCB, where a center or peripheral of the second coil is a second non-coil region; first conductive wires on the first non-coil region; and second conductive wires on the second non-coil region. Electric contacts are arranged between the first conductor and the second coil, and electrically connected in parallel to the first conductive wires and the portion of the second coil. Electric contacts are arranged between the second conductor and the first coil, and electrically connected in parallel to the second conductive wires and the portion of the first coil. The amount of charge is increased in the coil and resistance is reduced to overcome proximity effect.
Public/Granted literature
- US20160126009A1 WIRELESS CHARGING COIL PCB STRUCTURE Public/Granted day:2016-05-05
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