Invention Grant
- Patent Title: Multilayer ceramic electronic component and board having the same mounted thereon
- Patent Title (中): 具有安装在其上的多层陶瓷电子部件和板
-
Application No.: US14321305Application Date: 2014-07-01
-
Publication No.: US09595386B2Publication Date: 2017-03-14
- Inventor: Tae Youl You , Dae Bok Oh
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0111706 20130917
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/06 ; H01G4/35 ; H01G4/012 ; H01G4/12
Abstract:
A multilayer electronic component is disclosed with a body having a thickness (T) and a width (W) satisfying the equation T/W>1.0, an upper portion of the body including a first and second internal electrodes with an average width of M1 and a lower portion of the body including a first and second internal electrodes with an average width of M2 satisfying M1>M2.
Public/Granted literature
- US20150075854A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2015-03-19
Information query
