Invention Grant
US09595390B2 Method for filling at least one cavity of a multi-layer component with a filling material, and multi-layer component 有权
用填充材料填充多层部件的至少一个空腔的方法,以及多层部件

  • Patent Title: Method for filling at least one cavity of a multi-layer component with a filling material, and multi-layer component
  • Patent Title (中): 用填充材料填充多层部件的至少一个空腔的方法,以及多层部件
  • Application No.: US14420653
    Application Date: 2013-07-31
  • Publication No.: US09595390B2
    Publication Date: 2017-03-14
  • Inventor: Dieter SomitschMartin GallerAditya Rajapurkar
  • Applicant: EPCOS AG
  • Applicant Address: DE Munich
  • Assignee: EPCOS AG
  • Current Assignee: EPCOS AG
  • Current Assignee Address: DE Munich
  • Agency: McDermott Will & Emery LLP
  • Priority: DE102012107341 20120809
  • International Application: PCT/EP2013/066117 WO 20130731
  • International Announcement: WO2014/023634 WO 20140213
  • Main IPC: H01G4/30
  • IPC: H01G4/30 H01L41/083
Method for filling at least one cavity of a multi-layer component with a filling material, and multi-layer component
Abstract:
The invention relates to a method for filling at least one cavity (5a, 5b) of a multi-layer component (1) with filling material (9). In a first step, the method comprises providing a main body (2) of the multi-layer component (1), the main body (2) having at least one cavity (5a, 5b). In a subsequent step, the method comprises placing the main body (2) in a chamber (11) and then generating a first pressure, the first pressure being a negative pressure. Then, a filling material (9) is arranged on the main body (2). Furthermore, the invention relates to a multi-layer component (1). The multi-layer component (1) has a main body (2) with at least one cavity (5a, 5b), wherein the cavity (5a, 5b) is filled with a filling material (9) which has a viscosity of between 200 mPas and 2000 mPas.
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