Invention Grant
- Patent Title: Ceramic electronic component and manufacturing method therefor
- Patent Title (中): 陶瓷电子元件及其制造方法
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Application No.: US14804403Application Date: 2015-07-21
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Publication No.: US09595391B2Publication Date: 2017-03-14
- Inventor: Mitsunori Inoue , Naoko Nishimura , Tomohiko Mori
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2014-153118 20140728
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/228 ; H01G13/00 ; H01G4/008 ; H01G4/12
Abstract:
A ceramic electronic component that includes a ceramic element, and baked electrodes on a surface of the ceramic element. A resin film is formed at boundary sites between the ceramic element and the baked electrodes. The resin film includes a resin, and a cationic element that is a constituent element of the glass component in the baked electrodes.
Public/Granted literature
- US20160027585A1 CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR Public/Granted day:2016-01-28
Information query
