Invention Grant
- Patent Title: Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursor
- Patent Title (中): 使用氯化钨前体制备钨和氮化钨薄膜的方法
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Application No.: US14703732Application Date: 2015-05-04
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Publication No.: US09595470B2Publication Date: 2017-03-14
- Inventor: Hanna Bamnolker , Raashina Humayun , Juwen Gao , Michal Danek , Joshua Collins
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/285 ; C23C16/52 ; C23C16/04 ; C23C16/14 ; C23C16/455

Abstract:
Methods for forming tungsten film using fluorine-free tungsten precursors such as tungsten chlorides are provided. Methods involve depositing a tungsten nucleation layer by exposing a substrate to a reducing agent such as diborane (B2H6) and exposing the substrate to a tungsten chloride, followed by depositing bulk tungsten by exposing the substrate to a tungsten chloride and a reducing agent. Methods also involve diluting the reducing agent and exposing the substrate to a fluorine-free precursor in pulses to deposit a tungsten nucleation layer. Deposited films exhibit good step coverage and plugfill.
Public/Granted literature
- US20150325475A1 METHODS OF PREPARING TUNGSTEN AND TUNGSTEN NITRIDE THIN FILMS USING TUNGSTEN CHLORIDE PRECURSOR Public/Granted day:2015-11-12
Information query
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