Invention Grant
- Patent Title: Device manufacture and packaging method thereof
- Patent Title (中): 装置制造及其包装方法
-
Application No.: US14658540Application Date: 2015-03-16
-
Publication No.: US09595492B2Publication Date: 2017-03-14
- Inventor: Chien-Hsuan Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L21/027
- IPC: H01L21/027 ; H01L21/768 ; H01L23/522 ; H01L23/528
Abstract:
Some embodiments of the present disclosure provide a semiconductive device. The semiconductive device includes a first conductive layer and a second conductive layer above the first conductive layer. The second conductive layer includes a first portion and a second portion protruding from the first portion. A via structure is under the second conductive layer and on top of the first conductive layer. The via structure is substantially aligned vertically with the second portion.
Public/Granted literature
- US20160276266A1 DEVICE MANUFACTURE AND PACKAGING METHOD THEREOF Public/Granted day:2016-09-22
Information query
IPC分类:
